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Barrel contacts for vias/THT pads (drill-wall ring injection, verified against the analytic acosh spreading resistance), full solder-joint modeling of every populated THT hole (lead conductor, solder fill, one-sided pad coat, protruding-lead cone, exact pad shapes and DNP flags read from KiCad), configurable cap-drill threshold, and README model figures. The release now also attaches the docs/img figures. Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>