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Release 1.1.0
Barrel contacts for vias/THT pads (drill-wall ring injection, verified
against the analytic acosh spreading resistance), full solder-joint
modeling of every populated THT hole (lead conductor, solder fill,
one-sided pad coat, protruding-lead cone, exact pad shapes and DNP
flags read from KiCad), configurable cap-drill threshold, and README
model figures. The release now also attaches the docs/img figures.

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-17 12:32:03 +07:00
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2026-07-17 12:32:03 +07:00