janik
a2a8a9d702
Two-point fluxes across coarse-fine faces miss the tangential potential gradient (offset leaf centers), biasing R ~0.5-2% low. After the first solve, per-leaf gradients are reconstructed by least squares over face neighbors and the known tangential term g*delta*Gt moves to the right-hand side of a re-solve (ADAPTIVE_CORRECTION_PASSES, default 1). The matrix is unchanged, so the new PreparedSolver reuses the LU factorization / AMG hierarchy across passes; the corrected currents satisfy KCL exactly, so the power-balance identity, via currents and part fluxes all use them consistently (edge power = dV * I_corr). Measured: strip worst case -1.74% -> -0.028% (1 pass); feature-dense plate end-to-end -1.1% -> -0.011% at 7.2 s vs 25.9 s uniform (5.58M -> 823k unknowns). Tests tightened accordingly plus a passes-knob test. Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
105 lines
6.0 KiB
Python
105 lines
6.0 KiB
Python
"""All tunable constants. v1 has no GUI dialog: edit here, re-run.
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A future version may read overrides from <project>/fill_res_config.json.
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"""
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# --- Grid sizing ---
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# Benchmarked on the VOUT+ plane (147x59 mm): R changes < 0.3% from
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# 150 um cells down to 50 um. Accuracy is feature-limited (slots/necks
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# narrower than one cell), not plane-limited - override CELL_UM_OVERRIDE
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# for boards with sub-cell slots.
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TARGET_CELLS = 2_000_000 # auto cell size aims for roughly this many cells
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HARD_MAX_CELLS = 16_000_000 # abort above this (see GridSizeError message)
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MIN_CELL_UM = 25.0 # clamp for auto cell size
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MAX_CELL_UM = 500.0
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CELL_UM_OVERRIDE: float | None = None # force a cell size, bypasses auto (not HARD_MAX)
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MARGIN_CELLS = 2 # empty guard cells around the copper bbox
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# --- Physics ---
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RHO_CU_OHM_M = 1.68e-8 # copper resistivity at 20 degC
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COPPER_THICKNESS_UM: float | None = None # None -> stackup, fallback 35.0 with warning
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FALLBACK_THICKNESS_UM = 35.0
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TEST_CURRENT_A = 1.0 # default injected current (dialog/CLI-selectable)
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VIA_PLATING_UM = 18.0 # barrel plating thickness (always plated)
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VIAS_CAPPED = True # filled + capped vias (dialog checkbox):
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# outer-layer mouths carry a CAP_PLATING_UM
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# thin copper cap, inner-layer mouths are
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# holes. False = open mouths on all layers.
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# Ring/pad copper of vias is modeled either
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# way; THT-pad copper/drills are not.
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CAP_PLATING_UM = 15.0 # cap plating thickness (fab spec)
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INCLUDE_TH_PADS = True # plated through-hole pads stitch layers too
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SKIN_SIDES = 1 # skin-effect field config: 1 = plane facing a
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# return plane (conservative), 2 = isolated foil
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# --- Solder / mask-opening buildup ---
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INCLUDE_MASK_BUILDUP = False # OFF by default; dialog-toggleable. Zones on
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# F.Mask/B.Mask = mask openings that collect
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# solder on the pour underneath
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SOLDER_THICKNESS_UM = 50.0 # solder height over opened copper
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SOLDER_RHO_OHM_M = 1.32e-7 # SAC305, ~7.9x copper
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BUILDUP_EXTRA_CU_UM = 0.0 # optional user-added copper (busbar/wire
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# soldered into the opening); dialog-settable
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# --- Zone / layer selection ---
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INCLUDE_TRACKS = True # the net's traces (straight + arc tracks)
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# conduct together with the zone fills;
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# dialog-toggleable
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TRACK_1D_FACTOR = 3.0 # traces narrower than this many grid cells
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# become exact 1D resistor chains along their
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# centerline instead of rasterized outlines
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# (no discretization error in the trace R;
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# 0 = always rasterize)
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LAYER_HINT: str | None = None # e.g. "F.Cu" to disambiguate candidate fills
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ELECTRODE_POS_LAYER = "User.1" # rectangles on this layer mark V+ contact parts
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ELECTRODE_NEG_LAYER = "User.2" # rectangles on this layer mark V- contact parts
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ALWAYS_REFILL = False # refill zones even if KiCad says they are filled
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# --- Adaptive grid ---
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ADAPTIVE_CELLS = False # solve on a 2:1-balanced quadtree: fine at
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# copper boundaries/electrodes/features,
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# coarse plane interiors (dialog-toggleable).
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# Slight low bias (~0.5-1% on feature-dense
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# boards); large speed/memory wins on pours
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ADAPTIVE_MAX_CELL_UM = 2000.0 # coarsest leaf edge length. The MINIMUM
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# element size is the grid cell size itself
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# (auto / dialog / CELL_UM_OVERRIDE). Rarely
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# needs tuning: the guard distance already
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# caps leaf growth near features
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ADAPTIVE_GUARD = 4 # a leaf of size s needs >= GUARD*s cells of
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# clearance to the nearest feature
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ADAPTIVE_CORRECTION_PASSES = 1 # deferred-correction re-solves fixing the
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# coarse-fine interface flux bias (same
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# matrix, reused factorization/AMG). 1 pass
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# cuts the raw ~0.5-2% low bias to <0.03%
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# measured; 0 disables
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# --- Solver ---
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CONTACT_MODEL = "uniform" # "uniform": conductor pressed on top injects
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# orthogonally with uniform surface density
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# (J ramps across the contact); "equipotential":
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# ideal bonded lug (Dirichlet). The two bracket
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# a real contact: R_equi <= R_real <= R_uniform.
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SPSOLVE_MAX_UNKNOWNS = 500_000 # above this, AMG-preconditioned CG (pyamg;
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# Jacobi-CG if pyamg is missing). Direct is
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# exact and fastest for small grids; measured
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# at 1.4M unknowns: spsolve 13 s / ~3 GB,
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# AMG-CG 6 s at a fraction of the memory
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AMG_TOL = 1e-10 # relative residual of the AMG-CG solve
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CG_TOL = 1e-8 # Jacobi-CG fallback (no pyamg)
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CG_MAXITER = 50_000 # CG iterations are cheap; large grids need many
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# --- Geometry ---
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ARC_TOL_FRACTION = 0.5 # arc sagitta tolerance as a fraction of cell size
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# --- Plots / output ---
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CMAP_POTENTIAL = "viridis"
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CMAP_CURRENT = "inferno"
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CMAP_POWER = "magma"
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POWER_DYNAMIC_RANGE = 1e4 # LogNorm span for the power map (power ~ J^2)
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LOG_CURRENT_SCALE = True
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CURRENT_DYNAMIC_RANGE = 1e3 # LogNorm vmin = vmax / this
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DPI = 150
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INTERACTIVE = True # False -> save PNGs only, never open windows
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OUTPUT_DIRNAME = "fill_res_results"
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