Files
kicad-zone-resistance/fill_resistance/config.py
T
janik d34d3ade51 Model via ring copper and drill mouths (capping), dialog-toggleable
Each via now contributes its ring/pad copper (full-thickness disc of
the pad diameter on every spanned layer) and its drill mouth: with
"vias filled + capped" (dialog checkbox, default on, VIAS_CAPPED) the
mouth carries a CAP_PLATING_UM (15 um) thin copper cap on the outer
layers and is an open hole on inner layers; unchecked, mouths are open
everywhere. Mouth coverage is area-weighted per cell (4x4
supersampling) through a per-cell thickness map feeding the existing
harmonic-mean face machinery, so sub-cell mouths perturb the sheet by
their true covered fraction instead of whole cells. Fully swallowed
cells leave the mask; the barrel then attaches through the ring via the
existing pad-footprint search. THT-pad copper and drills stay outside
the model. Ring discs paint before 1D trace chains (chains see them as
regular copper), mouths after wide tracks (drills go through trace
copper). standalone gains --uncapped.

Tests: cap==foil identity against the feature-off reference, strict
R(solid) < R(cap) < R(hole) ordering, ring bridging a fill gap that a
ringless barrel cannot cross, gentle sub-cell perturbation at coarse
grids, and JSON roundtrip of the new fields.

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-15 16:42:21 +07:00

86 lines
4.8 KiB
Python

"""All tunable constants. v1 has no GUI dialog: edit here, re-run.
A future version may read overrides from <project>/fill_res_config.json.
"""
# --- Grid sizing ---
# Benchmarked on the VOUT+ plane (147x59 mm): R changes < 0.3% from
# 150 um cells down to 50 um. Accuracy is feature-limited (slots/necks
# narrower than one cell), not plane-limited - override CELL_UM_OVERRIDE
# for boards with sub-cell slots.
TARGET_CELLS = 2_000_000 # auto cell size aims for roughly this many cells
HARD_MAX_CELLS = 16_000_000 # abort above this (see GridSizeError message)
MIN_CELL_UM = 25.0 # clamp for auto cell size
MAX_CELL_UM = 500.0
CELL_UM_OVERRIDE: float | None = None # force a cell size, bypasses auto (not HARD_MAX)
MARGIN_CELLS = 2 # empty guard cells around the copper bbox
# --- Physics ---
RHO_CU_OHM_M = 1.68e-8 # copper resistivity at 20 degC
COPPER_THICKNESS_UM: float | None = None # None -> stackup, fallback 35.0 with warning
FALLBACK_THICKNESS_UM = 35.0
TEST_CURRENT_A = 1.0 # default injected current (dialog/CLI-selectable)
VIA_PLATING_UM = 18.0 # barrel plating thickness (always plated)
VIAS_CAPPED = True # filled + capped vias (dialog checkbox):
# outer-layer mouths carry a CAP_PLATING_UM
# thin copper cap, inner-layer mouths are
# holes. False = open mouths on all layers.
# Ring/pad copper of vias is modeled either
# way; THT-pad copper/drills are not.
CAP_PLATING_UM = 15.0 # cap plating thickness (fab spec)
INCLUDE_TH_PADS = True # plated through-hole pads stitch layers too
SKIN_SIDES = 1 # skin-effect field config: 1 = plane facing a
# return plane (conservative), 2 = isolated foil
# --- Solder / mask-opening buildup ---
INCLUDE_MASK_BUILDUP = False # OFF by default; dialog-toggleable. Zones on
# F.Mask/B.Mask = mask openings that collect
# solder on the pour underneath
SOLDER_THICKNESS_UM = 50.0 # solder height over opened copper
SOLDER_RHO_OHM_M = 1.32e-7 # SAC305, ~7.9x copper
BUILDUP_EXTRA_CU_UM = 0.0 # optional user-added copper (busbar/wire
# soldered into the opening); dialog-settable
# --- Zone / layer selection ---
INCLUDE_TRACKS = True # the net's traces (straight + arc tracks)
# conduct together with the zone fills;
# dialog-toggleable
TRACK_1D_FACTOR = 3.0 # traces narrower than this many grid cells
# become exact 1D resistor chains along their
# centerline instead of rasterized outlines
# (no discretization error in the trace R;
# 0 = always rasterize)
LAYER_HINT: str | None = None # e.g. "F.Cu" to disambiguate candidate fills
ELECTRODE_POS_LAYER = "User.1" # rectangles on this layer mark V+ contact parts
ELECTRODE_NEG_LAYER = "User.2" # rectangles on this layer mark V- contact parts
ALWAYS_REFILL = False # refill zones even if KiCad says they are filled
# --- Solver ---
CONTACT_MODEL = "uniform" # "uniform": conductor pressed on top injects
# orthogonally with uniform surface density
# (J ramps across the contact); "equipotential":
# ideal bonded lug (Dirichlet). The two bracket
# a real contact: R_equi <= R_real <= R_uniform.
SPSOLVE_MAX_UNKNOWNS = 500_000 # above this, AMG-preconditioned CG (pyamg;
# Jacobi-CG if pyamg is missing). Direct is
# exact and fastest for small grids; measured
# at 1.4M unknowns: spsolve 13 s / ~3 GB,
# AMG-CG 6 s at a fraction of the memory
AMG_TOL = 1e-10 # relative residual of the AMG-CG solve
CG_TOL = 1e-8 # Jacobi-CG fallback (no pyamg)
CG_MAXITER = 50_000 # CG iterations are cheap; large grids need many
# --- Geometry ---
ARC_TOL_FRACTION = 0.5 # arc sagitta tolerance as a fraction of cell size
# --- Plots / output ---
CMAP_POTENTIAL = "viridis"
CMAP_CURRENT = "inferno"
CMAP_POWER = "magma"
POWER_DYNAMIC_RANGE = 1e4 # LogNorm span for the power map (power ~ J^2)
LOG_CURRENT_SCALE = True
CURRENT_DYNAMIC_RANGE = 1e3 # LogNorm vmin = vmax / this
DPI = 150
INTERACTIVE = True # False -> save PNGs only, never open windows
OUTPUT_DIRNAME = "fill_res_results"