janik
06c62e04f8
DC/AC resistance, power dissipation, and via/injection-area currents of copper zone fills. KiCad 10 IPC-API plugin (kicad-python/kipy): multi-layer via-coupled FDM solver, multi-part terminals via User.1/User.2 marker layers, pads as contacts, uniform-injection and equipotential contact models, per-foil skin effect, optional solder/copper buildup on mask openings. 54-case test suite incl. exact analytic references. Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
22 lines
768 B
JSON
22 lines
768 B
JSON
{
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"$schema": "https://go.kicad.org/api/schemas/v1",
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"identifier": "th.co.b4l.fill-resistance",
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"name": "Fill Resistance",
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"description": "DC resistance of a copper zone fill between two rectangle electrodes",
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"runtime": {
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"type": "python"
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},
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"actions": [
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{
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"identifier": "fill-resistance-run",
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"name": "Fill Resistance",
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"description": "Select two rectangles marking the contact areas, then run to compute the fill resistance between them",
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"entrypoint": "fill_res_action.py",
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"show-button": true,
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"scopes": ["pcb"],
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"icons-light": ["icons/fill_res_24_light.png"],
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"icons-dark": ["icons/fill_res_24_dark.png"]
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}
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]
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}
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