Add the Payap University partnership: joint student programmes

Payap also wants to work closely with the project on new student
programmes: audio engineering (mastering, lathe cutting), IT, business
administration and more.

New docs/payap-partnership.md: why it fits (mastering/cutting engineers
are the hardest hires; Payap has music, IT, business, communication arts,
an English-language International College and pharmacy labs; the plant has
a lathe, production data and a real factory application), programme areas
mapped to the docs they draw on, and what it changes: a reason to bring
the cutting room (roadmap item 27) forward, a cutting engineer before the
students, lacquer and stylus cost of teaching, pre-release security for
customer audio, student access and safety, IT work on staging only, the
link to the Payap land, BOI R&D merit. Suggested form: MOU, internships,
short certificate courses first, degree tracks later; what to settle in
writing and questions for the next meeting.

Links from README (bullet, layout), site-candidates, roadmap item 27, the
supplier map's open training item and the BOI open items.

docs/boi.md

@@ -109,6 +109,9 @@ project timeline, ahead of equipment contracts.
 - Confirm current NEC/Lamphun area add-ons
 - Engage a BOI-registered consultant to structure the application so the
   solar, automation, and R&D measures stack on the base promotion
+- Check whether R&D contracted with Payap University and the joint student
+  programmes ([Payap partnership](payap-partnership.md)) count toward the
+  R&D merit or a skills-development measure
 - Keep any future label/content/retail arm in a separate entity: media and
   service activities carry different (and sometimes Thai-ownership)
   conditions, and mixing them muddies a clean manufacturing application