78 lines
2.6 KiB
Markdown
78 lines
2.6 KiB
Markdown
---
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title: PowerModule
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company: B4L Co. LTD.
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board_name: PowerModule
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variant: release
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revision: A
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date: 2024-03-30
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highlight: github-light
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stylesheet: custom.css
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kicad_theme: KiCAD Default
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dark_mode: false
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---
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# Fabrication Notes
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| Stackup | Dimensions | Drills |
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| :-------------------------------------: | :-------------------------------------------------------: | :----------------------------------: |
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1. FABRICATE PER IPC-6012A CLASS 2
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2. REFER TO ABOVE IMAGE FOR BOARD THICKNESSES, IMPEDANCE CONTROL, SOLDERMASK AND SURFACE FINISH DETAILS
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3. VENDOR SHOULD FOLLOW ROHS COMPLIANT PROCESS AND Pb FREE FOR MANUFACTURING
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4. PRINTED CIRCUIT BOARD SHALL COMPLY WITH REQUIREMENTS OF ANSI/J-STD-003
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5. FLATNESS REQUIREMENTS: TEST IN ACCORDANCE WITH THE CURRENT REVISION OF IPC-TM-650 2.4.22
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6. PCB MATERIAL REQUIREMENTS: Tg 170 C OR EQUIVALENT
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7. ALL DIMENSIONS ARE IN MILLIMETERS UNLESS OTHERWISE SPECIFIED
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# Top Layer
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# Inner 1 Layer
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# Inner 2 Layer
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# Inner 3 Layer
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# Inner 4 Layer
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# Bottom Layer
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_flipped_
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# Renders
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| Top View | Bottom View |
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| :--------------------------------------------------------: | :-------------------------------------------------------: |
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# Top Assembly
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| Top View | Render |
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| :----------------------------------------------------------------: | :-----------------------------------------------: |
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# Bottom Assembly
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| Bottom View | Render |
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| :-------------------------------------------------------: | :---------------------------------------------: |
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