Files
kicad-zone-resistance/tests
janik bc95b444b4
Build PCM package / build (push) Successful in 6s
Model SMD pad copper: exact net pad shapes stamped on their layers
Pads are the junctions where traces and thermal-relief spokes actually
meet; without their copper a multi-track junction necks down to the
accidental overlap of the rounded track ends, or is severed outright.
gather_smd_pad_copper fetches the exact shape of every undrilled pad
on the net (one API call per pad, layer from the padstack) and
build_problem stamps them onto their own layer (INCLUDE_SMD_PADS).
Selected SMD-pad contacts get their real copper as a side effect
(previously electrode-shape intersected whatever lay underneath).
Dead-end pads become floating islands that the existing connectivity
restriction drops.

Closes the documented SMD-pad-copper limitation (prompted by the
padne comparison).

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-17 13:37:06 +07:00
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