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The clipped lead of a soldered THT contact protrudes THT_LEAD_PROTRUSION_MM (1.5 mm default, 0 disables) out of the hole on the side opposite the component, and a solder cone wraps it: full protrusion height at the drill wall, tapering linearly to zero at the pad edge. Painted as per-cell extra conduction-equivalent copper via stack.thick_scale - the tall solder column at the wall pulls the joint vicinity to lead potential (equivalent to extending the barrel wall vertically), the taper carries the radial spreading. DC-exact additive conductance; at f > 0 the factor multiplies the skin-corrected sheet conductance like the via mouths (documented approximation). The protrusion side is looked up from the owning footprint (pads store absolute positions; component on F.Cu -> lead tents on B.Cu), with a logged B.Cu fallback. Dump schema gains protrusion_side and tht_protrusion_nm (defaults keep older v6 dumps loading). Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>