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Build PCM package / build (push) Successful in 6s
- THT pad copper is now part of the conductor: the exact pad outline (incl. oblong/custom shapes) is fetched from KiCad once per pad and stamped onto every included layer (the outer shape stands in for inner rings). Annular rings bridge antipads, and joints land on real copper instead of only pour coverage. - The internal lead conductor is modeled in every solder-filled hole: a cylinder of drill - THT_LEAD_CLEARANCE_MM (0.25 fab rule) with THT_LEAD_RHO_OHM_M (copper default; config for brass/steel leads), in parallel with the solder annulus and the plating. - Drill mouths of THT pads: populated pads keep conducting mouth copper (stands in for the solder plug - conservative, the plug is worth ~200 um of copper equivalent); DNP pad holes are cut open on every layer like uncapped via mouths. - Oblong pads: the coat uses the exact pad shape; the lead cone tapers within the inscribed circle (new pad_min_nm on ViaLink/Electrode) so the long axis is not overstated sideways. Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>