janik
4ff729e192
Build PCM package / build (push) Successful in 13s
- Selected vias and through-hole pads inject at the drill-wall ring on every spanned layer (both contact models), not the whole pad face, so the pad/pour spreading resistance is part of the result. Vias are now selectable as contacts. - Soldered THT joints: the hole is modeled solder-filled (core in parallel with the plating, also for stitching THT barrels) and the pad face carries an average-thickness solder coat over the modeled copper (SOLDER_THICKNESS_UM). - Vias with drills above a configurable threshold (dialog field, default CAP_MAX_DRILL_MM = 0.5) keep open mouths even with capping selected - the fab caps only small vias. - Geometry dump schema v6: electrode barrel fields, cap_max_drill_nm. - Verified against R = rho/(pi t)*acosh(d/2a) for two circular contacts on a sheet (+2.6% at h = 0.15 mm, a = 1 mm; uniform model above the equipotential one as required by the contact bracket). Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>