e7627352c1
- Refuse the uniform contact model when the fills form multiple disconnected copper groups that each touch both terminals: the prescribed injection split is ill-posed and the grounded system was singular, silently returning garbage (e.g. negative gigaohms). connected_restrict now reports the component count; a power-balance backstop (SolverError) catches any other inconsistent solve. - Connect via/pad barrels to the nearest fill copper within the pad footprint (+1 cell) instead of only the exact center cell, so thermal-relief spokes still stitch layers; barrels that reach fill on fewer than two layers are warned about. ViaLink gains pad_nm (extracted from the padstack, JSON-roundtripped). - Validate dialog input on OK (layers, current > 0, cell > 0, parseable frequency, extra Cu >= 0) with an inline error instead of silently substituting defaults; parse_frequency raises on garbage; pipeline rejects i_test <= 0; choose_cell_size rejects non-positive overrides. - Warn when a contact part is dropped by the connectivity restriction; floor instead of truncate in cell_of; correct the uniform-model summary line; drop an unused variable; refresh plugin.json wording. Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
22 lines
867 B
JSON
22 lines
867 B
JSON
{
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"$schema": "https://go.kicad.org/api/schemas/v1",
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"identifier": "th.co.b4l.fill-resistance",
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"name": "Fill Resistance",
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"description": "DC/AC resistance of copper zone fills between two contacts (marker rectangles or pads), single- or multi-layer with via coupling",
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"runtime": {
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"type": "python"
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},
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"actions": [
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{
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"identifier": "fill-resistance-run",
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"name": "Fill Resistance",
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"description": "Mark the contacts (rectangles on the User.1/User.2 marker layers and/or selected pads), then run to compute the fill resistance between them",
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"entrypoint": "fill_res_action.py",
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"show-button": true,
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"scopes": ["pcb"],
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"icons-light": ["icons/fill_res_24_light.png"],
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"icons-dark": ["icons/fill_res_24_dark.png"]
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}
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]
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}
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