Skin resistance is a small fraction of real AC impedance (proximity
and inductance dominate), so AC must not appear in the descriptions.
README headline, PCM/plugin metadata, pyproject, dialog note, CLI
help and the summary label now all say: skin-only lower bound on the
resistance rise, not an AC impedance simulation.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
kipy's Board.remove_items discards the DeleteItemsResponse, and the
proto warns the overall status may read OK even when nothing was
deleted - a locked image comes back IDS_IMMUTABLE. remove_overlays
went through the proto layer already for create; do the same for
delete, so a locked overlay is reported instead of silently surviving
while a second image is stacked on top of it.
Slots that a narrower run does not write kept the previous solve's
heatmap and read as current; clear them. The whole push is now one
commit, so a single undo reverts it rather than one layer of it.
_pad_polygons probed F.Cu before B.Cu regardless of which side the
joint protrudes from, so a pad sized differently per copper layer had
its solder coat measured from the wrong face; probe the solder side
first. Pads on no single copper layer are now noted rather than
silently skipped.
_fail could report nothing at all: before the output directory exists
no PNG is written, and with no GUI toolkit plots only opens saved
PNGs - the broken-plugin-environment case the docstring promises to
cover. Fall back to the temp dir, and never let reporting mask the
fault. Frequency input now keeps its specific rejection reason, as
the other numeric fields do.
After a solve, the per-layer current-density maps can be pushed into
the open board as reference images on User.9..User.12 (stackup order,
top first) - visible right in the editor, toggled like any layer,
never plotted to gerbers. Dialog checkbox, default OFF; every push
replaces all reference images on those layers.
Rendering (fill_resistance/overlay.py, KiCad-free and tested headless):
one pixel per grid cell, opaque over copper with the log scale lifted
off the colormap's near-black bottom (dark canvas), transparent
elsewhere, one pixel of half-alpha edge bleed so the overlay reaches
the drawn outline instead of stopping half a cell short. Pushing lives
in board_io (ReferenceImage via the IPC API, KiCad >= 10.0.1; scale =
width / (pixels * 1 inch / 300 PPI), position = image center); kipy
0.7.1 swallows creation errors, so the per-item status is read from
the raw CreateItemsResponse. pipeline.run takes an optional overlay
callback; failures are reported, never fatal.
tools/kicad_overlay_test.py pushes a fiducial alignment pattern (KiCad
bbox readback verified placement to half a pixel); tools/
kicad_heatmap_overlay.py runs the whole thing headless against the
open board, filtering marker rectangles of other nets' analyses via
the exact copper test.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
- adaptive: barrel links could attach to coarse leaves (up to 1 mm),
making the whole leaf equipotential and deleting the local spreading
resistance - via-field results read up to ~13% low. Barrel attachment
cells are now pinned into the keep-fine set before the quadtree is
built; the guard ring grades around them.
- skin/dialog: the decimal-comma rewrite turned '1,500' into 1.5, a
silent 1000x error in frequency, test current or cell size. Ambiguous
comma patterns (thousands separators, multiple commas, mixed with a
dot) now raise with a message; a real decimal comma ('1,5') still
parses.
- dialog: Selection.adaptive default now matches the documented
on-by-default; the adaptive accuracy claim is aligned to the measured
0.03% quoted in README and config.
- Selected vias and through-hole pads inject at the drill-wall ring on
every spanned layer (both contact models), not the whole pad face,
so the pad/pour spreading resistance is part of the result. Vias are
now selectable as contacts.
- Soldered THT joints: the hole is modeled solder-filled (core in
parallel with the plating, also for stitching THT barrels) and the
pad face carries an average-thickness solder coat over the modeled
copper (SOLDER_THICKNESS_UM).
- Vias with drills above a configurable threshold (dialog field,
default CAP_MAX_DRILL_MM = 0.5) keep open mouths even with capping
selected - the fab caps only small vias.
- Geometry dump schema v6: electrode barrel fields, cap_max_drill_nm.
- Verified against R = rho/(pi t)*acosh(d/2a) for two circular contacts
on a sheet (+2.6% at h = 0.15 mm, a = 1 mm; uniform model above the
equipotential one as required by the contact bracket).
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Two-point fluxes across coarse-fine faces miss the tangential potential
gradient (offset leaf centers), biasing R ~0.5-2% low. After the first
solve, per-leaf gradients are reconstructed by least squares over face
neighbors and the known tangential term g*delta*Gt moves to the
right-hand side of a re-solve (ADAPTIVE_CORRECTION_PASSES, default 1).
The matrix is unchanged, so the new PreparedSolver reuses the LU
factorization / AMG hierarchy across passes; the corrected currents
satisfy KCL exactly, so the power-balance identity, via currents and
part fluxes all use them consistently (edge power = dV * I_corr).
Measured: strip worst case -1.74% -> -0.028% (1 pass); feature-dense
plate end-to-end -1.1% -> -0.011% at 7.2 s vs 25.9 s uniform (5.58M ->
823k unknowns). Tests tightened accordingly plus a passes-knob test.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
config.ADAPTIVE_CELLS (dialog checkbox "adaptive cells", off by
default; standalone --adaptive) routes run_solve through
fill_resistance/adaptive.py: per-layer balanced leaf grids where every
non-uniform fine cell (electrodes, 1D chain cells, buildup, via-mouth
thickness map) is pinned at the fine size, leaf faces via the
series-half-cell rule, chain links and barrels re-attached by node id,
connectivity restriction and both contact models on the leaf graph via
solver cores extracted for reuse (_equipotential_core, _uniform_core,
_conductance_params, _barrel_links). All fields (V, |J|, power density)
are computed per leaf and expanded to the fine grid, so plots, summary
and dumps are unchanged.
Element sizes: minimum = the grid cell size itself (auto / dialog /
CELL_UM_OVERRIDE); maximum = ADAPTIVE_MAX_CELL_UM (2 mm default);
ADAPTIVE_GUARD sets the clearance a block needs to grow.
Measured end-to-end (feature-dense 120x120 plate, h=50um): 25.9 s ->
5.4 s, 5.58M -> 823k unknowns, R -1.1%. Accuracy documented honestly:
coarse-fine interfaces carry a first-order tangential flux error
biasing R low by ~0.5-2% depending on geometry (worst on narrow
strips); the earlier assumption that linear fields solve exactly on the
leaf graph was wrong - offset centers across size transitions leave an
unpaired residue. Gradient-corrected interface fluxes remain as phase 4
if tighter accuracy per leaf is needed.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Each via now contributes its ring/pad copper (full-thickness disc of
the pad diameter on every spanned layer) and its drill mouth: with
"vias filled + capped" (dialog checkbox, default on, VIAS_CAPPED) the
mouth carries a CAP_PLATING_UM (15 um) thin copper cap on the outer
layers and is an open hole on inner layers; unchecked, mouths are open
everywhere. Mouth coverage is area-weighted per cell (4x4
supersampling) through a per-cell thickness map feeding the existing
harmonic-mean face machinery, so sub-cell mouths perturb the sheet by
their true covered fraction instead of whole cells. Fully swallowed
cells leave the mask; the barrel then attaches through the ring via the
existing pad-footprint search. THT-pad copper and drills stay outside
the model. Ring discs paint before 1D trace chains (chains see them as
regular copper), mouths after wide tracks (drills go through trace
copper). standalone gains --uncapped.
Tests: cap==foil identity against the feature-off reference, strict
R(solid) < R(cap) < R(hole) ordering, ring bridging a fill gap that a
ringless barrel cannot cross, gentle sub-cell perturbation at coarse
grids, and JSON roundtrip of the new fields.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Straight tracks become capsule outline polygons (rectangle +
semicircular caps), arc tracks annular bands with end caps, both
tessellated to the same sagitta tolerance as zone-fill arcs; they merge
into the per-layer copper next to the fills, so rasterization, via
stitching, the solver and the plots handle them unchanged. Trace-only
layers and trace-only nets now qualify as candidates. Dialog checkbox
(on by default, INCLUDE_TRACKS) toggles them per run.
Hole-less polygons (every track outline) now paint the layer mask
directly instead of allocating a full-frame temporary each.
Tests: exact N-cell chain on a rasterized capsule, analytic annular-
sector convergence for an arc trace, capsule/arc-band outline geometry
invariants, collinear-arc degradation, and fill+trace union solve.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
- Refuse the uniform contact model when the fills form multiple
disconnected copper groups that each touch both terminals: the
prescribed injection split is ill-posed and the grounded system was
singular, silently returning garbage (e.g. negative gigaohms).
connected_restrict now reports the component count; a power-balance
backstop (SolverError) catches any other inconsistent solve.
- Connect via/pad barrels to the nearest fill copper within the pad
footprint (+1 cell) instead of only the exact center cell, so
thermal-relief spokes still stitch layers; barrels that reach fill on
fewer than two layers are warned about. ViaLink gains pad_nm
(extracted from the padstack, JSON-roundtripped).
- Validate dialog input on OK (layers, current > 0, cell > 0, parseable
frequency, extra Cu >= 0) with an inline error instead of silently
substituting defaults; parse_frequency raises on garbage; pipeline
rejects i_test <= 0; choose_cell_size rejects non-positive overrides.
- Warn when a contact part is dropped by the connectivity restriction;
floor instead of truncate in cell_of; correct the uniform-model
summary line; drop an unused variable; refresh plugin.json wording.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
DC/AC resistance, power dissipation, and via/injection-area currents of
copper zone fills. KiCad 10 IPC-API plugin (kicad-python/kipy):
multi-layer via-coupled FDM solver, multi-part terminals via User.1/User.2
marker layers, pads as contacts, uniform-injection and equipotential
contact models, per-foil skin effect, optional solder/copper buildup on
mask openings. 54-case test suite incl. exact analytic references.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
janik
grabowski