Tracks are now first-class Problem objects (TrackSeg: centerline +
width, dump schema v5), so the wide/narrow decision replays at raster
time: traces at least TRACK_1D_FACTOR (3) cells wide rasterize from
their outline as before; narrower ones mark the cells their centerline
crosses as copper and connect them with explicit conductance links
carrying the trace's TRUE arc length per link - no staircase inflation
for diagonals or arcs, and no discretization error in the trace R, at
any grid size. Links across cells already joined by pour faces are
skipped (union, not sum); chain-only cells get no sheet faces (their
copper is narrower than a cell). Electrodes, via barrels, connectivity
restriction and the skin-effect scaling all work on chain cells
unchanged.
This removes the need to shrink the cell size for thin traces: a 0.2 mm
bridge at 500 um cells now matches its finely-rasterized ground truth
within a few percent (tested), including diagonal and arc traces.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
- Hybrid rasterizer: PIL scanline fill for the bulk, with cells in a
~2 px band around each ring edge re-tested exactly against the
polygon - cell-for-cell identical to the old center-in-polygon pass
(equivalence test added) but O(vertices + cells) instead of
O(vertices x cells). Measured 4.5 s -> 0.11 s at 1.45M cells with
8.8k polygon vertices.
- AMG-preconditioned CG (pyamg, new requirement) above 500k unknowns:
measured 7.0 s vs 15.3 s spsolve at 1.4M unknowns at a fraction of
the memory, R identical to 1e-6; the old Jacobi-CG (kept as fallback
when pyamg is missing) needed tens of minutes there. spsolve stays
the default below 500k where it is exact and fastest.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
- Refuse the uniform contact model when the fills form multiple
disconnected copper groups that each touch both terminals: the
prescribed injection split is ill-posed and the grounded system was
singular, silently returning garbage (e.g. negative gigaohms).
connected_restrict now reports the component count; a power-balance
backstop (SolverError) catches any other inconsistent solve.
- Connect via/pad barrels to the nearest fill copper within the pad
footprint (+1 cell) instead of only the exact center cell, so
thermal-relief spokes still stitch layers; barrels that reach fill on
fewer than two layers are warned about. ViaLink gains pad_nm
(extracted from the padstack, JSON-roundtripped).
- Validate dialog input on OK (layers, current > 0, cell > 0, parseable
frequency, extra Cu >= 0) with an inline error instead of silently
substituting defaults; parse_frequency raises on garbage; pipeline
rejects i_test <= 0; choose_cell_size rejects non-positive overrides.
- Warn when a contact part is dropped by the connectivity restriction;
floor instead of truncate in cell_of; correct the uniform-model
summary line; drop an unused variable; refresh plugin.json wording.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
DC/AC resistance, power dissipation, and via/injection-area currents of
copper zone fills. KiCad 10 IPC-API plugin (kicad-python/kipy):
multi-layer via-coupled FDM solver, multi-part terminals via User.1/User.2
marker layers, pads as contacts, uniform-injection and equipotential
contact models, per-foil skin effect, optional solder/copper buildup on
mask openings. 54-case test suite incl. exact analytic references.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
janik