Commit Graph

3 Commits

Author SHA1 Message Date
janik b2277f65bf Full solder joint at every populated THT pad, read from KiCad
Build PCM package / build (push) Successful in 8s
No size-threshold guessing: whether a hole is a via or a THT pad
already comes from KiCad (board.get_vias vs drilled board.get_pads).
Every populated THT pad of the net now carries the complete joint the
contacts got: solder-filled barrel, average-thickness coat over a
pad-diameter disc on the outer layers, and the protruding-lead cone on
the side opposite its owning footprint. The footprint side and the
Do-not-populate flag are read from KiCad (footprint pads store absolute
positions, so owner lookup is an exact (x, y, number) map); DNP pads
stay plating-only with no joint. Contact pads are deduplicated by
barrel center so their cone/coat is never applied twice.

Barrels are now gathered in single-layer runs too: via rings and drill
mouths perforate a lone plane, THT joints stiffen it locally.

ViaLink gains solder_filled + protrusion_side (legacy dumps load with
the old every-THT-pad-filled semantics).

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-16 19:00:09 +07:00
janik 4ff729e192 Barrel contacts for vias/THT pads; configurable cap-drill threshold
Build PCM package / build (push) Successful in 13s
- Selected vias and through-hole pads inject at the drill-wall ring on
  every spanned layer (both contact models), not the whole pad face,
  so the pad/pour spreading resistance is part of the result. Vias are
  now selectable as contacts.
- Soldered THT joints: the hole is modeled solder-filled (core in
  parallel with the plating, also for stitching THT barrels) and the
  pad face carries an average-thickness solder coat over the modeled
  copper (SOLDER_THICKNESS_UM).
- Vias with drills above a configurable threshold (dialog field,
  default CAP_MAX_DRILL_MM = 0.5) keep open mouths even with capping
  selected - the fab caps only small vias.
- Geometry dump schema v6: electrode barrel fields, cap_max_drill_nm.
- Verified against R = rho/(pi t)*acosh(d/2a) for two circular contacts
  on a sheet (+2.6% at h = 0.15 mm, a = 1 mm; uniform model above the
  equipotential one as required by the contact bracket).

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-16 18:28:47 +07:00
janik d34d3ade51 Model via ring copper and drill mouths (capping), dialog-toggleable
Each via now contributes its ring/pad copper (full-thickness disc of
the pad diameter on every spanned layer) and its drill mouth: with
"vias filled + capped" (dialog checkbox, default on, VIAS_CAPPED) the
mouth carries a CAP_PLATING_UM (15 um) thin copper cap on the outer
layers and is an open hole on inner layers; unchecked, mouths are open
everywhere. Mouth coverage is area-weighted per cell (4x4
supersampling) through a per-cell thickness map feeding the existing
harmonic-mean face machinery, so sub-cell mouths perturb the sheet by
their true covered fraction instead of whole cells. Fully swallowed
cells leave the mask; the barrel then attaches through the ring via the
existing pad-footprint search. THT-pad copper and drills stay outside
the model. Ring discs paint before 1D trace chains (chains see them as
regular copper), mouths after wide tracks (drills go through trace
copper). standalone gains --uncapped.

Tests: cap==foil identity against the feature-off reference, strict
R(solid) < R(cap) < R(hole) ordering, ring bridging a fill gap that a
ringless barrel cannot cross, gentle sub-cell perturbation at coarse
grids, and JSON roundtrip of the new fields.

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-15 16:42:21 +07:00