Commit Graph

3 Commits

Author SHA1 Message Date
grabowski d9ca118e1b uv dev environment, README writing pass, publish hygiene
Build PCM package / build (push) Successful in 8s
- pyproject.toml + uv.lock: uv-managed dev environment (uv sync /
  uv run pytest). requirements.txt stays: KiCad builds the plugin's
  runtime venv from it and the PCM zip packages it.
- README: em-dash and run-on cleanup (34 -> 22, the rest deliberate),
  split the 120-word THT solder-joint sentence, fix the documented
  ADAPTIVE_MAX_CELL_UM value (2 mm -> 1 mm, config has 1000 um), fix
  the *Packaging / publishing* cross-reference, dev sections now use
  uv sync / uv run.
- LLM disclaimer: "most commits" carry the trailer (32 of 39), figures
  claim now excepts the hand-drawn hole cross-section, reference the
  UT3513+ measured-vs-computed validation.
- .gitignore: local AI-tooling artifacts; deploy scripts exclude
  pyproject.toml/uv.lock; error-figure title punctuation aligned with
  the other window titles.
2026-07-17 13:24:08 +07:00
janik 4e39f598a5 Add GPL-3.0 license, PCM packaging, and cross-platform deploy
- LICENSE.txt (GPL-3.0-or-later), declared in the new PCM v2
  metadata.json (validated against the official schema)
- tools/build_package.py builds the registry-layout addon zip in dist/
  plus the submission metadata copy with sha256/sizes and a release
  download_url derived from the Gitea homepage
- tools/deploy.py: symlink/copy deploy for Linux, macOS and Windows
- 64 px resources/icon.png for the PCM listing
- README: Linux setup/dev commands, packaging and license sections

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-15 14:55:24 +07:00
janik 06c62e04f8 Initial import: KiCad zone resistance plugin
DC/AC resistance, power dissipation, and via/injection-area currents of
copper zone fills. KiCad 10 IPC-API plugin (kicad-python/kipy):
multi-layer via-coupled FDM solver, multi-part terminals via User.1/User.2
marker layers, pads as contacts, uniform-injection and equipotential
contact models, per-foil skin effect, optional solder/copper buildup on
mask openings. 54-case test suite incl. exact analytic references.

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-14 17:22:00 +07:00