The mouth of a populated THT pad kept only foil copper on every layer:
on the component side and inner layers the joint looked (and conducted)
like plain plane, and current had to crowd through the single barrel
attachment cell. The filled hole - lead cylinder plus solder bore - now
adds conduction-equivalent copper of the full hole depth on EVERY
spanned layer (the pin continues beyond both mouths, so each layer sees
the whole plug cross-section). Side to side the joint differs only by
the solder: coat and cone stay on the protrusion side.
Cone and plug contributions accumulate ADDITIVELY (stack.t_extra_nm)
and fold into thick_scale once; multiplying the factors would overstate
mouth cells carrying both. The raster map draws filled mouths in a
darker tin with their own legend entry.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
The drill's y dimension was discarded (padstack.drill.diameter.x only),
so a milled slot became a round hole of its x size - contact rings,
drill mouths and lead cones painted circles larger than the oblong pad
itself, and the cone was skipped outright (pad_min <= drill).
Slots now keep their true stadium shape, rotated with the pad (KiCad
CCW, y down): Electrode/ViaLink carry the end-cap offset vector,
drill_nm becomes the slot WIDTH, and a shared slot_distance() reduces
to the plain radius for round holes. The barrel wall ring, mouth
coverage, cone taper and the solver's attachment search all follow the
slot; barrel_resistance uses the stadium perimeter and bore area. The
stitching-coat fallback becomes a capsule along the slot (inscribed
disc when the axis is unknown) instead of a largest-dimension disc.
Slot fields round-trip through the JSON dumps.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
- THT pad copper is now part of the conductor: the exact pad outline
(incl. oblong/custom shapes) is fetched from KiCad once per pad and
stamped onto every included layer (the outer shape stands in for
inner rings). Annular rings bridge antipads, and joints land on real
copper instead of only pour coverage.
- The internal lead conductor is modeled in every solder-filled hole:
a cylinder of drill - THT_LEAD_CLEARANCE_MM (0.25 fab rule) with
THT_LEAD_RHO_OHM_M (copper default; config for brass/steel leads),
in parallel with the solder annulus and the plating.
- Drill mouths of THT pads: populated pads keep conducting mouth
copper (stands in for the solder plug - conservative, the plug is
worth ~200 um of copper equivalent); DNP pad holes are cut open on
every layer like uncapped via mouths.
- Oblong pads: the coat uses the exact pad shape; the lead cone tapers
within the inscribed circle (new pad_min_nm on ViaLink/Electrode) so
the long axis is not overstated sideways.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
The pad face is wetted where the joint is: the protrusion side,
opposite the component (already read from the owning footprint). The
component-side pad face stays bare - contact_solder_buildups and
tht_joint_buildups no longer coat both outer layers.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
No size-threshold guessing: whether a hole is a via or a THT pad
already comes from KiCad (board.get_vias vs drilled board.get_pads).
Every populated THT pad of the net now carries the complete joint the
contacts got: solder-filled barrel, average-thickness coat over a
pad-diameter disc on the outer layers, and the protruding-lead cone on
the side opposite its owning footprint. The footprint side and the
Do-not-populate flag are read from KiCad (footprint pads store absolute
positions, so owner lookup is an exact (x, y, number) map); DNP pads
stay plating-only with no joint. Contact pads are deduplicated by
barrel center so their cone/coat is never applied twice.
Barrels are now gathered in single-layer runs too: via rings and drill
mouths perforate a lone plane, THT joints stiffen it locally.
ViaLink gains solder_filled + protrusion_side (legacy dumps load with
the old every-THT-pad-filled semantics).
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
The clipped lead of a soldered THT contact protrudes
THT_LEAD_PROTRUSION_MM (1.5 mm default, 0 disables) out of the hole on
the side opposite the component, and a solder cone wraps it: full
protrusion height at the drill wall, tapering linearly to zero at the
pad edge. Painted as per-cell extra conduction-equivalent copper via
stack.thick_scale - the tall solder column at the wall pulls the joint
vicinity to lead potential (equivalent to extending the barrel wall
vertically), the taper carries the radial spreading. DC-exact additive
conductance; at f > 0 the factor multiplies the skin-corrected sheet
conductance like the via mouths (documented approximation).
The protrusion side is looked up from the owning footprint (pads store
absolute positions; component on F.Cu -> lead tents on B.Cu), with a
logged B.Cu fallback. Dump schema gains protrusion_side and
tht_protrusion_nm (defaults keep older v6 dumps loading).
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
- Selected vias and through-hole pads inject at the drill-wall ring on
every spanned layer (both contact models), not the whole pad face,
so the pad/pour spreading resistance is part of the result. Vias are
now selectable as contacts.
- Soldered THT joints: the hole is modeled solder-filled (core in
parallel with the plating, also for stitching THT barrels) and the
pad face carries an average-thickness solder coat over the modeled
copper (SOLDER_THICKNESS_UM).
- Vias with drills above a configurable threshold (dialog field,
default CAP_MAX_DRILL_MM = 0.5) keep open mouths even with capping
selected - the fab caps only small vias.
- Geometry dump schema v6: electrode barrel fields, cap_max_drill_nm.
- Verified against R = rho/(pi t)*acosh(d/2a) for two circular contacts
on a sheet (+2.6% at h = 0.15 mm, a = 1 mm; uniform model above the
equipotential one as required by the contact bracket).
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
janik