4 Commits

Include renames

Author	SHA1	Message	Date
janikandClaude Fable 5	959446978c	Model every THT pad hole: exact pad copper, lead conductor, DNP holes ... - THT pad copper is now part of the conductor: the exact pad outline (incl. oblong/custom shapes) is fetched from KiCad once per pad and stamped onto every included layer (the outer shape stands in for inner rings). Annular rings bridge antipads, and joints land on real copper instead of only pour coverage. - The internal lead conductor is modeled in every solder-filled hole: a cylinder of drill - THT_LEAD_CLEARANCE_MM (0.25 fab rule) with THT_LEAD_RHO_OHM_M (copper default; config for brass/steel leads), in parallel with the solder annulus and the plating. - Drill mouths of THT pads: populated pads keep conducting mouth copper (stands in for the solder plug - conservative, the plug is worth ~200 um of copper equivalent); DNP pad holes are cut open on every layer like uncapped via mouths. - Oblong pads: the coat uses the exact pad shape; the lead cone tapers within the inscribed circle (new pad_min_nm on ViaLink/Electrode) so the long axis is not overstated sideways. Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>	2026-07-16 19:15:57 +07:00
janikandClaude Fable 5	b2277f65bf	Full solder joint at every populated THT pad, read from KiCad ... No size-threshold guessing: whether a hole is a via or a THT pad already comes from KiCad (board.get_vias vs drilled board.get_pads). Every populated THT pad of the net now carries the complete joint the contacts got: solder-filled barrel, average-thickness coat over a pad-diameter disc on the outer layers, and the protruding-lead cone on the side opposite its owning footprint. The footprint side and the Do-not-populate flag are read from KiCad (footprint pads store absolute positions, so owner lookup is an exact (x, y, number) map); DNP pads stay plating-only with no joint. Contact pads are deduplicated by barrel center so their cone/coat is never applied twice. Barrels are now gathered in single-layer runs too: via rings and drill mouths perforate a lone plane, THT joints stiffen it locally. ViaLink gains solder_filled + protrusion_side (legacy dumps load with the old every-THT-pad-filled semantics). Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>	2026-07-16 19:00:09 +07:00
janikandClaude Fable 5	4ff729e192	Barrel contacts for vias/THT pads; configurable cap-drill threshold ... - Selected vias and through-hole pads inject at the drill-wall ring on every spanned layer (both contact models), not the whole pad face, so the pad/pour spreading resistance is part of the result. Vias are now selectable as contacts. - Soldered THT joints: the hole is modeled solder-filled (core in parallel with the plating, also for stitching THT barrels) and the pad face carries an average-thickness solder coat over the modeled copper (SOLDER_THICKNESS_UM). - Vias with drills above a configurable threshold (dialog field, default CAP_MAX_DRILL_MM = 0.5) keep open mouths even with capping selected - the fab caps only small vias. - Geometry dump schema v6: electrode barrel fields, cap_max_drill_nm. - Verified against R = rho/(pi t)*acosh(d/2a) for two circular contacts on a sheet (+2.6% at h = 0.15 mm, a = 1 mm; uniform model above the equipotential one as required by the contact bracket). Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>	2026-07-16 18:28:47 +07:00
janikandClaude Fable 5	d34d3ade51	Model via ring copper and drill mouths (capping), dialog-toggleable ... Each via now contributes its ring/pad copper (full-thickness disc of the pad diameter on every spanned layer) and its drill mouth: with "vias filled + capped" (dialog checkbox, default on, VIAS_CAPPED) the mouth carries a CAP_PLATING_UM (15 um) thin copper cap on the outer layers and is an open hole on inner layers; unchecked, mouths are open everywhere. Mouth coverage is area-weighted per cell (4x4 supersampling) through a per-cell thickness map feeding the existing harmonic-mean face machinery, so sub-cell mouths perturb the sheet by their true covered fraction instead of whole cells. Fully swallowed cells leave the mask; the barrel then attaches through the ring via the existing pad-footprint search. THT-pad copper and drills stay outside the model. Ring discs paint before 1D trace chains (chains see them as regular copper), mouths after wide tracks (drills go through trace copper). standalone gains --uncapped. Tests: cap==foil identity against the feature-off reference, strict R(solid) < R(cap) < R(hole) ordering, ring bridging a fill gap that a ringless barrel cannot cross, gentle sub-cell perturbation at coarse grids, and JSON roundtrip of the new fields. Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>	2026-07-15 16:42:21 +07:00