uv dev environment, README writing pass, publish hygiene
Build PCM package / build (push) Successful in 8s
Build PCM package / build (push) Successful in 8s
- pyproject.toml + uv.lock: uv-managed dev environment (uv sync / uv run pytest). requirements.txt stays: KiCad builds the plugin's runtime venv from it and the PCM zip packages it. - README: em-dash and run-on cleanup (34 -> 22, the rest deliberate), split the 120-word THT solder-joint sentence, fix the documented ADAPTIVE_MAX_CELL_UM value (2 mm -> 1 mm, config has 1000 um), fix the *Packaging / publishing* cross-reference, dev sections now use uv sync / uv run. - LLM disclaimer: "most commits" carry the trailer (32 of 39), figures claim now excepts the hand-drawn hole cross-section, reference the UT3513+ measured-vs-computed validation. - .gitignore: local AI-tooling artifacts; deploy scripts exclude pyproject.toml/uv.lock; error-figure title punctuation aligned with the other window titles.
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@@ -6,8 +6,8 @@ between two contacts, **single- or multi-layer**: the chosen net's fills
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solved as coupled finite-difference sheets linked by the net's **via
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and through-hole-pad barrels** (18 µm plating, configurable). At a user-set **frequency** the exact 1D foil/barrel
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skin-effect correction is applied (AC results are a rigorous lower
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bound — see *Model & limits*). Shows per-layer rasterized maps,
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potential, current density, and **power density**, reports **per-via
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bound; see *Model & limits*). Shows per-layer rasterized maps,
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potential, current density, and **power density**, and reports **per-via
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currents** (via ampacity!) and total dissipation at a **selectable test
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current**. PNGs + a text summary are saved per run.
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@@ -15,7 +15,7 @@ current**. PNGs + a text summary are saved per run.
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*Real output on a synthetic two-layer net: current from a soldered
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THT-pad contact (V+, injected at the drill-wall ring) squeezes past a
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notch in the F.Cu pour, transfers through the stitching-via field into
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the B.Cu pour and leaves at the V− lug — per-via currents and the
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the B.Cu pour and leaves at the V− lug. Per-via currents and the
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hottest via are reported.*
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@@ -35,7 +35,7 @@ SWIG API. Requires KiCad **10.0.1+**.
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on Windows or `/usr/bin/python3` on Linux (after a 9→10 upgrade it
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can point at KiCad 9).
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3. **Deploy** (dev checkout; end users install the PCM zip instead, see
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*Packaging*):
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*Packaging / publishing*):
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```powershell
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powershell -ExecutionPolicy Bypass -File deploy.ps1 # junction (dev)
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powershell -ExecutionPolicy Bypass -File deploy.ps1 -Mode Copy
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@@ -52,13 +52,13 @@ SWIG API. Requires KiCad **10.0.1+**.
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## Usage
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1. Mark the current-injection terminals. Each terminal may have
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**multiple parts** (all merged into one externally-bonded contact):
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**multiple parts** (all merged into one externally bonded contact):
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- **V+ rectangles on `User.1`**, **V− rectangles on `User.2`**
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(marker layers, configurable via `ELECTRODE_POS_LAYER` /
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`ELECTRODE_NEG_LAYER`), any number per side, axis-aligned;
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- **pads and vias** (SMD pad: real copper shape on its own layer;
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through-hole pads and vias become **barrel contacts** — the current
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enters at the drill wall on every spanned layer, see below) —
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through-hole pads and vias become **barrel contacts**: the current
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enters at the drill wall on every spanned layer, see below);
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selected pads/vias fill a side that has no rectangles;
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- legacy: exactly 2 selected contacts with no marker rectangles still
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works; empty selection scans the whole board's marker layers.
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@@ -93,7 +93,7 @@ SWIG API. Requires KiCad **10.0.1+**.
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dialog's **"capped up to drill"** threshold (default
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`CAP_MAX_DRILL_MM = 0.5`) keep open mouths even with capping
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selected. Layer-to-layer the cap never matters at DC (it is in
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parallel with the annular-ring contact, not in series) — the checkbox
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parallel with the annular-ring contact, not in series), so the checkbox
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only affects in-plane conduction across outer-layer mouths. Sub-cell
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mouths scale their cells' sheet conductance by the true covered
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fraction (4×4 supersampling), so coarse grids see the correct small
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@@ -103,18 +103,18 @@ SWIG API. Requires KiCad **10.0.1+**.
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oblong pads, fetched from KiCad; the outer shape stands in for inner
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rings) are stamped onto every included layer, and every **populated**
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pad carries its full **soldered joint** on its SOLDER side (opposite
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the component; the component-side pad face stays bare): the hole
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the component; the component-side pad face stays bare). The hole
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holds the **component lead** (a cylinder of drill −
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`THT_LEAD_CLEARANCE_MM`, resistivity `THT_LEAD_RHO_OHM_M`, copper by
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default — raise it for brass/steel leads) **plus solder** in the
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remaining annulus, both in parallel with the plating; the mouth
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copper stays conducting (it stands in for the plug — conservative,
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the plug is worth far more than the foil); the pad face gets the
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average-thickness solder coat (exact pad shape) and the
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default; raise it for brass/steel leads) **plus solder** in the
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remaining annulus, both in parallel with the plating. The mouth
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copper stays conducting: it stands in for the solder plug, which is
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worth far more than the foil, so this is conservative. The pad face
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gets the average-thickness solder coat (exact pad shape) and the
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protruding-lead cone (see barrel contacts below; on oblong pads the
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cone tapers within the inscribed circle). Whether a hole is a via or
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a THT pad, the owning footprint's side, and its **Do not populate**
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flag are all read from KiCad — **DNP pads** get an **open hole** and
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flag are all read from KiCad. **DNP pads** get an **open hole** and
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a plating-only barrel, no joint. At f > 0 the thickness scaling is
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applied multiplicatively to the skin-corrected sheet conductance
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(approximation). Per layer a barrel attaches to
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@@ -194,7 +194,7 @@ SWIG API. Requires KiCad **10.0.1+**.
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(`SKIN_SIDES = 1` in config: plane facing a return plane; `2` =
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isolated foil), and the analogous correction for the 18 µm barrel wall.
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Enter one frequency per run (e.g. a switching harmonic, with its RMS
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amplitude as the test current) — suffixes `k`/`M` accepted.
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amplitude as the test current); suffixes `k`/`M` are accepted.
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**Caveat:** only through-thickness crowding is modeled. Lateral
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(proximity-effect) redistribution needs a magneto-quasistatic solver
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and is not captured — since the resistance-driven distribution is the
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@@ -206,15 +206,15 @@ SWIG API. Requires KiCad **10.0.1+**.
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not the geometric foil thickness.
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- 5-point FDM per layer on an auto-sized shared grid (~2 M fine cells
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with the uniform grid; ~8 M with the adaptive grid, whose unknown
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count no longer scales with them). Direct sparse solve up to 500 k
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unknowns, AMG-preconditioned CG (pyamg) above — Jacobi-CG if pyamg is
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missing. Discretization error typically ≲ 2 % at defaults — halve the
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cell size and compare to judge convergence.
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count no longer scales with the fine-cell count). Direct sparse solve
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up to 500 k unknowns, AMG-preconditioned CG (pyamg) above (Jacobi-CG
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if pyamg is missing). Discretization error typically ≲ 2 % at
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defaults; halve the cell size and compare to judge convergence.
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- **Adaptive cells** (dialog checkbox, **on by default**;
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`ADAPTIVE_CELLS`):
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solves on a 2:1-balanced quadtree — fine cells at copper boundaries,
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electrodes, traces, via mouths and buildup, blocks up to
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`ADAPTIVE_MAX_CELL_UM` (2 mm) in plane interiors (`ADAPTIVE_GUARD`
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`ADAPTIVE_MAX_CELL_UM` (1 mm) in plane interiors (`ADAPTIVE_GUARD`
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sets the clearance a block needs to grow). The **minimum element size
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is the grid cell size itself** (auto / dialog / `CELL_UM_OVERRIDE`);
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the uniform limit reproduces the normal grid exactly. Large
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@@ -246,20 +246,20 @@ accordingly more trustworthy than absolute numbers.
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Every run writes `geometry_dump.json`; re-solve without KiCad:
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```powershell
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.venv\Scripts\python.exe -m fill_resistance.standalone dump.json `
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uv run python -m fill_resistance.standalone dump.json `
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[--current 40] [--cell-um 50] [--layers F.Cu,In1.Cu] [--no-show] `
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[--out DIR] [--force-iterative]
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```
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Dev environment, tests, headless extraction (Windows shown; on
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Linux/macOS use `.venv/bin/python`):
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Dev environment, tests, headless extraction — [uv](https://docs.astral.sh/uv/)
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manages the venv from `pyproject.toml`/`uv.lock` (`requirements.txt`
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stays: KiCad builds the plugin's runtime venv from it):
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```powershell
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uv venv --python 3.11 .venv
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uv pip install --python .venv\Scripts\python.exe kicad-python numpy scipy pyamg matplotlib pytest
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.venv\Scripts\python.exe -m pytest tests -q # incl. exact analytic cases
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.venv\Scripts\python.exe tools\api_probe.py # IPC API probe vs live KiCad
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.venv\Scripts\python.exe -m fill_resistance.board_io dump.json [NET] # extract only
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uv sync # one-time env setup
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uv run pytest -q # incl. exact analytic cases
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uv run python tools/api_probe.py # IPC API probe vs live KiCad
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uv run python -m fill_resistance.board_io dump.json [NET] # extract only
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```
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## Packaging / publishing
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@@ -272,7 +272,7 @@ filled in. To publish: upload the zip to a release, set `download_url`
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registry copy as `packages/th.co.b4l.fill-resistance/metadata.json` in a
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merge request to <https://gitlab.com/kicad/addons/metadata>. Icons are
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regenerated with `python tools/gen_icons.py`; the README figures in
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`docs/img/` with `.venv\Scripts\python.exe tools\gen_readme_figs.py`
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`docs/img/` with `uv run python tools/gen_readme_figs.py`
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(real solver output on small synthetic boards, plus the hand-drawn
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hole cross-section).
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@@ -294,18 +294,20 @@ GPL-3.0-or-later — see [LICENSE](LICENSE).
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## LLM disclaimer
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This plugin was developed with an LLM — Anthropic's **Claude** (Claude
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This plugin was developed with an LLM: Anthropic's **Claude** (Claude
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Code, model Claude Fable 5). The physics model, solver, tests, tooling
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and this documentation (including the figures, which are generated by
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the solver itself) were written by the model, feature by feature, under
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human direction and review (janik / B4L); commits carry a
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`Co-Authored-By: Claude` trailer.
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and this documentation (including the figures; all but the hand-drawn
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hole cross-section are generated by the solver itself) were written by
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the model, feature by feature, under human direction and review
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(janik / B4L); most commits carry a `Co-Authored-By: Claude` trailer.
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What keeps this honest: the test suite pins the numerics to exact
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analytic references (strip and annulus resistances, the acosh spreading
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resistance of two circular contacts, skin-effect limits, power-balance
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identities) and to convergence/regression checks — run it with
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`pytest tests`. Nevertheless, an LLM wrote this: read *Model & limits*
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identities) and to convergence/regression checks; run it with
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`uv run pytest`. Real boards were measured against a UT3513+ micro-ohm
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meter (see *Measured vs. computed* above). Nevertheless, an LLM wrote
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this: read *Model & limits*
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critically, treat surprising numbers with the usual engineering
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suspicion, and cross-check against a hand estimate before trusting a
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result with hardware. Bug reports are very welcome.
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