README usage: mixed rect+pads selection example, solve-time warning
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Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
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janik
2026-07-22 14:28:10 +07:00
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@@ -58,8 +58,14 @@ SWIG API. Requires KiCad **10.0.1+**.
`ELECTRODE_NEG_LAYER`), any number per side, axis-aligned;
- **pads and vias** (SMD pad: real copper shape on its own layer;
through-hole pads and vias become **barrel contacts**: the current
enters at the drill wall on every spanned layer, see below);
selected pads/vias fill a side that has no rectangles;
enters at the drill wall on every spanned layer, see below).
Selected pads/vias fill the side that has **no rectangles**, so
mixing both kinds is the everyday workflow: e.g. select **one
rectangle on `User.1`** (V+) **plus any number of pads / THT
holes** (Ctrl-click) — the pads together form the V terminal
(a connector's pin group, a via cluster, …). All selected
pads/vias go to that one side; if both marker layers already
provide rectangles, selecting pads on top is an error;
- legacy: exactly 2 selected contacts with no marker rectangles still
works; empty selection scans the whole board's marker layers.
2. **Select the contacts**, click the **Fill Resistance** Ω button.
@@ -68,7 +74,11 @@ SWIG API. Requires KiCad **10.0.1+**.
("All selected layers" = bolted-lug/through contact), the **test
current**, and optionally a grid cell size. Multiple layers are coupled
through the net's via/pad barrels automatically.
4. Read R / voltage drop / total power in the figure titles and status
4. Wait for the solve. Depending on board size, included layers, cell
size and your hardware it can take **considerable time** — large
multi-layer pours at fine cell sizes may run for minutes (on our
test setup a typical real-board run finishes in ≈ 8 s). Then read
R / voltage drop / total power in the figure titles and status
bar. Outputs land in `<board dir>\fill_res_results\<timestamp>\`:
per-layer `1_raster_map` / `2_potential` / `3_current_density` /
`4_power_density` PNGs, `summary.txt` (incl. the busiest vias with