README: 1D traces now show |J|; teardrops included; AC |J| reference
Follow the swarm-review fixes: chain cells display the true in-trace current density, teardrop zones conduct, and AC current-density maps are referenced to the skin-reduced equivalent thickness.
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@@ -2,9 +2,9 @@
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Computes the **DC or AC resistance of copper zone fills and traces**
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Computes the **DC or AC resistance of copper zone fills and traces**
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between two contacts, **single- or multi-layer**: the chosen net's fills
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between two contacts, **single- or multi-layer**: the chosen net's fills
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and tracks on the selected copper layers are solved as coupled
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(teardrops included) and tracks on the selected copper layers are
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finite-difference sheets linked by the net's **via and through-hole-pad
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solved as coupled finite-difference sheets linked by the net's **via
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barrels** (18 µm plating, configurable). At a user-set **frequency** the exact 1D foil/barrel
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and through-hole-pad barrels** (18 µm plating, configurable). At a user-set **frequency** the exact 1D foil/barrel
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skin-effect correction is applied (AC results are a rigorous lower
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skin-effect correction is applied (AC results are a rigorous lower
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bound — see *Model & limits*). Shows per-layer rasterized maps,
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bound — see *Model & limits*). Shows per-layer rasterized maps,
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potential, current density, and **power density**, reports **per-via
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potential, current density, and **power density**, reports **per-via
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@@ -96,8 +96,9 @@ SWIG API. Requires KiCad **10.0.1+**.
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`TRACK_1D_FACTOR` (3) grid cells are modeled as exact **1D resistor
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`TRACK_1D_FACTOR` (3) grid cells are modeled as exact **1D resistor
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chains** along their centerline — true arc length per link, so their
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chains** along their centerline — true arc length per link, so their
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series resistance carries no discretization error and no cell-size
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series resistance carries no discretization error and no cell-size
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tuning is needed for thin traces. 1D-modeled traces show potential and
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tuning is needed for thin traces. 1D-modeled traces show potential,
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power density but no |J| field. Pad copper other than the selected
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power density, and |J| (the true in-trace density from the link
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currents, |ΔV|/(ρ·Δl)). Pad copper other than the selected
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contacts is still **not** part of the conductor model.
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contacts is still **not** part of the conductor model.
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- **Solder buildup on mask openings** (dialog checkbox, **off by
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- **Solder buildup on mask openings** (dialog checkbox, **off by
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default**; `INCLUDE_MASK_BUILDUP`): zones drawn on `F.Mask`/`B.Mask`
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default**; `INCLUDE_MASK_BUILDUP`): zones drawn on `F.Mask`/`B.Mask`
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@@ -131,7 +132,10 @@ SWIG API. Requires KiCad **10.0.1+**.
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and is not captured — since the resistance-driven distribution is the
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and is not captured — since the resistance-driven distribution is the
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minimum-dissipation one, AC results are a rigorous **lower bound**.
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minimum-dissipation one, AC results are a rigorous **lower bound**.
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Rule of thumb for 70 µm foil: skin is negligible below ~300 kHz
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Rule of thumb for 70 µm foil: skin is negligible below ~300 kHz
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(δ = 173 µm at 142 kHz), ~+11 % at 1 MHz.
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(δ = 173 µm at 142 kHz), ~+11 % at 1 MHz. At f > 0 the |J| maps are
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referenced to the skin-reduced conduction-equivalent thickness
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t/(R_AC/R_DC) — the density in the copper that actually conducts —
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not the geometric foil thickness.
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- 5-point FDM per layer on an auto-sized shared grid (~2 M fine cells
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- 5-point FDM per layer on an auto-sized shared grid (~2 M fine cells
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with the uniform grid; ~8 M with the adaptive grid, whose unknown
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with the uniform grid; ~8 M with the adaptive grid, whose unknown
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count no longer scales with them). Direct sparse solve up to 500 k
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count no longer scales with them). Direct sparse solve up to 500 k
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