Solder cone around protruding THT leads (tent structure)
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The clipped lead of a soldered THT contact protrudes THT_LEAD_PROTRUSION_MM (1.5 mm default, 0 disables) out of the hole on the side opposite the component, and a solder cone wraps it: full protrusion height at the drill wall, tapering linearly to zero at the pad edge. Painted as per-cell extra conduction-equivalent copper via stack.thick_scale - the tall solder column at the wall pulls the joint vicinity to lead potential (equivalent to extending the barrel wall vertically), the taper carries the radial spreading. DC-exact additive conductance; at f > 0 the factor multiplies the skin-corrected sheet conductance like the via mouths (documented approximation). The protrusion side is looked up from the owning footprint (pads store absolute positions; component on F.Cu -> lead tents on B.Cu), with a logged B.Cu fallback. Dump schema gains protrusion_side and tht_protrusion_nm (defaults keep older v6 dumps loading). Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
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@@ -125,9 +125,17 @@ SWIG API. Requires KiCad **10.0.1+**.
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soldered **THT joint** additionally assumes the **hole is filled with
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solder** (core in parallel with the plating) and the **pad face
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carries an average-thickness solder coat** (`SOLDER_THICKNESS_UM`,
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50 µm) over the modeled copper under the pad shape. To model a probe
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pressed onto the pad face instead, draw a marker rectangle over the
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pad.
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50 µm) over the modeled copper under the pad shape. The **clipped
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lead protrudes** `THT_LEAD_PROTRUSION_MM` (1.5 mm, 0 = off) on the
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side opposite the component (taken from the owning footprint;
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assumed `B.Cu` if it cannot be found) and a **solder cone** wraps
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it: full protrusion height at the drill wall, tapering linearly to
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zero at the pad edge, applied as extra conduction-equivalent copper
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per cell. The tall solder column at the wall pulls the joint
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vicinity to lead potential — equivalent to extending the barrel wall
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vertically — while the taper carries the radial spreading. To model
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a probe pressed onto the pad face instead, draw a marker rectangle
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over the pad.
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- **Contact models** (dialog / `CONTACT_MODEL`): default **uniform
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injection** — a conductor pressed on top feeds the current orthogonally
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with uniform surface density, so |J| ramps across the contact area
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