Model every THT pad hole: exact pad copper, lead conductor, DNP holes

- THT pad copper is now part of the conductor: the exact pad outline
  (incl. oblong/custom shapes) is fetched from KiCad once per pad and
  stamped onto every included layer (the outer shape stands in for
  inner rings). Annular rings bridge antipads, and joints land on real
  copper instead of only pour coverage.
- The internal lead conductor is modeled in every solder-filled hole:
  a cylinder of drill - THT_LEAD_CLEARANCE_MM (0.25 fab rule) with
  THT_LEAD_RHO_OHM_M (copper default; config for brass/steel leads),
  in parallel with the solder annulus and the plating.
- Drill mouths of THT pads: populated pads keep conducting mouth
  copper (stands in for the solder plug - conservative, the plug is
  worth ~200 um of copper equivalent); DNP pad holes are cut open on
  every layer like uncapped via mouths.
- Oblong pads: the coat uses the exact pad shape; the lead cone tapers
  within the inscribed circle (new pad_min_nm on ViaLink/Electrode) so
  the long axis is not overstated sideways.

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>

tests/test_capping.py

@@ -50,9 +50,13 @@ def test_cap_at_foil_thickness_is_identity():
     so the result equals the feature-off reference (a 'pad'-kind barrel,
     which skips rings and mouths) with the mouth fully inside copper."""
     r_cap, _ = _solve(_two_layer(capped=True, cap_um=70.0), 0.1)
-    # a bare 'pad' barrel (solder_filled defaults False) is plating-only,
-    # exactly like the via's
-    r_ref, _ = _solve(_two_layer(kind="pad"), 0.1)
+    ref = _two_layer(kind="pad")
+    # populated pads skip rings and mouths; kill the lead + solder core
+    # so the reference barrel matches the via's plating-only resistance
+    ref.vias[0].solder_filled = True
+    ref.solder_rho_ohm_m = 1e30
+    ref.tht_lead_clearance_nm = 10 ** 9
+    r_ref, _ = _solve(ref, 0.1)
     assert r_cap.R_ohm == pytest.approx(r_ref.R_ohm, rel=1e-9)