Populated THT holes conduct in-plane as their solder plug + lead

The mouth of a populated THT pad kept only foil copper on every layer:
on the component side and inner layers the joint looked (and conducted)
like plain plane, and current had to crowd through the single barrel
attachment cell. The filled hole - lead cylinder plus solder bore - now
adds conduction-equivalent copper of the full hole depth on EVERY
spanned layer (the pin continues beyond both mouths, so each layer sees
the whole plug cross-section). Side to side the joint differs only by
the solder: coat and cone stay on the protrusion side.

Cone and plug contributions accumulate ADDITIVELY (stack.t_extra_nm)
and fold into thick_scale once; multiplying the factors would overstate
mouth cells carrying both. The raster map draws filled mouths in a
darker tin with their own legend entry.

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
This commit is contained in:
janik
2026-07-17 20:38:01 +07:00
parent c77e3408bd
commit 666abaa50f
4 changed files with 131 additions and 20 deletions
+9 -3
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@@ -107,9 +107,15 @@ SWIG API. Requires KiCad **10.0.1+**.
holds the **component lead** (a cylinder of drill
`THT_LEAD_CLEARANCE_MM`, resistivity `THT_LEAD_RHO_OHM_M`, copper by
default; raise it for brass/steel leads) **plus solder** in the
remaining annulus, both in parallel with the plating. The mouth
copper stays conducting: it stands in for the solder plug, which is
worth far more than the foil, so this is conservative. The pad face
remaining annulus, both in parallel with the plating. The filled
hole also conducts **in-plane on every spanned layer** (component
side and inner layers included): the mouth keeps its copper and
additionally carries the plug — lead disc plus solder bore — as
conduction-equivalent copper of the **full hole depth** (the pin
continues beyond both mouths, so each layer sees the whole plug
cross-section). The joint is side-symmetric except for the solder:
coat and cone on the solder side only. On the raster map these
mouths render in a darker tin color. The pad face
gets the average-thickness solder coat (exact pad shape) and the
protruding-lead cone (see barrel contacts below; on oblong pads the
cone tapers to the pad's short dimension). **Slotted (oval) holes**