Barrel contacts for vias/THT pads; configurable cap-drill threshold
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- Selected vias and through-hole pads inject at the drill-wall ring on every spanned layer (both contact models), not the whole pad face, so the pad/pour spreading resistance is part of the result. Vias are now selectable as contacts. - Soldered THT joints: the hole is modeled solder-filled (core in parallel with the plating, also for stitching THT barrels) and the pad face carries an average-thickness solder coat over the modeled copper (SOLDER_THICKNESS_UM). - Vias with drills above a configurable threshold (dialog field, default CAP_MAX_DRILL_MM = 0.5) keep open mouths even with capping selected - the fab caps only small vias. - Geometry dump schema v6: electrode barrel fields, cap_max_drill_nm. - Verified against R = rho/(pi t)*acosh(d/2a) for two circular contacts on a sheet (+2.6% at h = 0.15 mm, a = 1 mm; uniform model above the equipotential one as required by the contact bracket). Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
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@@ -28,7 +28,13 @@ VIAS_CAPPED = True # filled + capped vias (dialog checkbox):
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# Ring/pad copper of vias is modeled either
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# way; THT-pad copper/drills are not.
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CAP_PLATING_UM = 15.0 # cap plating thickness (fab spec)
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INCLUDE_TH_PADS = True # plated through-hole pads stitch layers too
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CAP_MAX_DRILL_MM = 0.5 # fab caps only small vias: drills above this
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# stay open even with VIAS_CAPPED
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# (dialog-settable)
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INCLUDE_TH_PADS = True # plated through-hole pads stitch layers too;
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# their holes are modeled solder-filled (a
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# soldered component lead), so the solder core
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# conducts in parallel with the plating
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SKIN_SIDES = 1 # skin-effect field config: 1 = plane facing a
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# return plane (conservative), 2 = isolated foil
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