Release 1.1.0

Barrel contacts for vias/THT pads (drill-wall ring injection, verified
against the analytic acosh spreading resistance), full solder-joint
modeling of every populated THT hole (lead conductor, solder fill,
one-sided pad coat, protruding-lead cone, exact pad shapes and DNP
flags read from KiCad), configurable cap-drill threshold, and README
model figures. The release now also attaches the docs/img figures.

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>

.gitea/workflows/build-pcm.yml

@@ -35,11 +35,12 @@ jobs:
             dist/*.zip
             dist/metadata-registry.json
 
-      - name: Create release with the zip attached
+      - name: Create release with the zip, registry metadata and figures
         if: startsWith(github.ref, 'refs/tags/v')
         uses: akkuman/gitea-release-action@b8d9144f302c68610911db1aaf722708d5c02d94 # v1
         with:
           files: |
             dist/*.zip
             dist/metadata-registry.json
+            docs/img/*.png
           token: ${{ secrets.GITEA_TOKEN }}

metadata.json

@@ -2,7 +2,7 @@
     "$schema": "https://go.kicad.org/pcm/schemas/v2",
     "name": "Fill Resistance",
     "description": "DC/AC resistance of copper zone fills and traces between two contacts, single- or multi-layer with via coupling; current and power density maps.",
-    "description_full": "Computes the DC or AC resistance of copper zone fills and traces between two contacts (marker rectangles on User.1/User.2 and/or selected pads), single- or multi-layer: the chosen net's fills and tracks are solved as coupled finite-difference sheets linked by the net's via and through-hole-pad barrels; traces narrower than the grid become exact 1D resistor chains, and an adaptive multi-resolution grid (fine at features, coarse plane interiors, deferred-corrected) keeps large boards fast.\n\nShows per-layer rasterized maps, potential, current density and power density, reports per-via currents (via ampacity) and total dissipation at a selectable test current. At a user-set frequency the exact 1D foil/barrel skin-effect correction is applied (AC results are a rigorous lower bound). PNGs, a text summary and a re-solvable geometry dump are saved per run.\n\nNote: the first load builds the plugin's Python environment (numpy, scipy, pyamg, matplotlib, PySide6) and can take several minutes.",
+    "description_full": "Computes the DC or AC resistance of copper zone fills and traces between two contacts (marker rectangles on User.1/User.2 and/or selected pads/vias), single- or multi-layer: the chosen net's fills and tracks are solved as coupled finite-difference sheets linked by the net's via and through-hole-pad barrels. Selected vias/THT pads inject at the drill-wall barrel, and every populated THT hole carries its full solder joint (component lead, solder fill, one-sided pad coat and protruding-lead cone) with exact pad shapes and do-not-populate flags read from KiCad; traces narrower than the grid become exact 1D resistor chains, and an adaptive multi-resolution grid (fine at features, coarse plane interiors, deferred-corrected) keeps large boards fast.\n\nShows per-layer rasterized maps, potential, current density and power density, reports per-via currents (via ampacity) and total dissipation at a selectable test current. At a user-set frequency the exact 1D foil/barrel skin-effect correction is applied (AC results are a rigorous lower bound). PNGs, a text summary and a re-solvable geometry dump are saved per run.\n\nNote: the first load builds the plugin's Python environment (numpy, scipy, pyamg, matplotlib, PySide6) and can take several minutes.",
     "identifier": "th.co.b4l.fill-resistance",
     "type": "plugin",
     "author": {
@@ -17,7 +17,7 @@
     },
     "versions": [
         {
-            "version": "1.0.1",
+            "version": "1.1.0",
             "status": "stable",
             "kicad_version": "10.0",
             "runtime": "ipc"