B4L/C64PSU

Files

2025-09-08 12:20:25 +07:00

title, company, board_name, variant, revision, date, highlight, stylesheet, kicad_theme, dark_mode

title	company	board_name	variant	revision	date	highlight	stylesheet	kicad_theme	dark_mode
PowerModule	B4L Co. LTD.	PowerModule	release	A	2024-03-30	github-light	custom.css	KiCAD Default	false

Fabrication Notes

Stackup	Dimensions	Drills
![{Stackup}](./images/stackup.png =550)	![{Edge.Cuts,User.5,F.Fab}](./images/dimensions.png =350)	![{Drill}](./images/drills.png =350)

FABRICATE PER IPC-6012A CLASS 2
REFER TO ABOVE IMAGE FOR BOARD THICKNESSES, IMPEDANCE CONTROL, SOLDERMASK AND SURFACE FINISH DETAILS
VENDOR SHOULD FOLLOW ROHS COMPLIANT PROCESS AND Pb FREE FOR MANUFACTURING
PRINTED CIRCUIT BOARD SHALL COMPLY WITH REQUIREMENTS OF ANSI/J-STD-003
FLATNESS REQUIREMENTS: TEST IN ACCORDANCE WITH THE CURRENT REVISION OF IPC-TM-650 2.4.22
PCB MATERIAL REQUIREMENTS: Tg 170 C OR EQUIVALENT
ALL DIMENSIONS ARE IN MILLIMETERS UNLESS OTHERWISE SPECIFIED

Top Layer

![{F.Cu}](./images/fcu.png =550)

![{In1.Cu}](./images/in1cu.png =550)

![{In2.Cu}](./images/in2cu.png =550)

![{In3.Cu}](./images/in3cu.png =550)

![{In4.Cu}](./images/in4cu.png =550)

![{B.Cu}](./images/bcu.png =550) flipped

Top View	Bottom View
![{Render/front/90/0/0}](./images/render-display.png =550)	![{Render/bottom/0/0/360}](./images/back-render.png =550)

Top View	Render
![{Edge.Cuts,F.Cu,F.Mask,F.Fab}](./images/front-assembly.png =550)	![Front render](./images/render-display.png =550)

Bottom View	Render
![{B.Cu,B.Mask,B.Fab}](./images/bottom-assembly.png =550)	![Bottom render](./images/back-render.png =550)