"""All tunable constants. v1 has no GUI dialog: edit here, re-run. A future version may read overrides from /fill_res_config.json. """ # --- Grid sizing --- # Benchmarked on the VOUT+ plane (147x59 mm): R changes < 0.3% from # 150 um cells down to 50 um. Accuracy is feature-limited (slots/necks # narrower than one cell), not plane-limited - override CELL_UM_OVERRIDE # for boards with sub-cell slots. TARGET_CELLS = 2_000_000 # auto cell size aims for roughly this many cells HARD_MAX_CELLS = 16_000_000 # abort above this (see GridSizeError message) MIN_CELL_UM = 25.0 # clamp for auto cell size MAX_CELL_UM = 500.0 CELL_UM_OVERRIDE: float | None = None # force a cell size, bypasses auto (not HARD_MAX) MARGIN_CELLS = 2 # empty guard cells around the copper bbox # --- Physics --- RHO_CU_OHM_M = 1.68e-8 # copper resistivity at 20 degC COPPER_THICKNESS_UM: float | None = None # None -> stackup, fallback 35.0 with warning FALLBACK_THICKNESS_UM = 35.0 TEST_CURRENT_A = 1.0 # default injected current (dialog/CLI-selectable) VIA_PLATING_UM = 18.0 # barrel plating thickness (always plated). # Via capping is NOT modeled: layer-to-layer # the cap (>=15um per fab spec, thinner than # the foil) is parallel to the annular-ring # contact, not in series; in-plane every via # mouth is treated as solid layer-thickness # copper (error bound: see README). INCLUDE_TH_PADS = True # plated through-hole pads stitch layers too SKIN_SIDES = 1 # skin-effect field config: 1 = plane facing a # return plane (conservative), 2 = isolated foil # --- Solder / mask-opening buildup --- INCLUDE_MASK_BUILDUP = False # OFF by default; dialog-toggleable. Zones on # F.Mask/B.Mask = mask openings that collect # solder on the pour underneath SOLDER_THICKNESS_UM = 50.0 # solder height over opened copper SOLDER_RHO_OHM_M = 1.32e-7 # SAC305, ~7.9x copper BUILDUP_EXTRA_CU_UM = 0.0 # optional user-added copper (busbar/wire # soldered into the opening); dialog-settable # --- Zone / layer selection --- INCLUDE_TRACKS = True # the net's traces (straight + arc tracks) # conduct together with the zone fills; # dialog-toggleable TRACK_1D_FACTOR = 3.0 # traces narrower than this many grid cells # become exact 1D resistor chains along their # centerline instead of rasterized outlines # (no discretization error in the trace R; # 0 = always rasterize) LAYER_HINT: str | None = None # e.g. "F.Cu" to disambiguate candidate fills ELECTRODE_POS_LAYER = "User.1" # rectangles on this layer mark V+ contact parts ELECTRODE_NEG_LAYER = "User.2" # rectangles on this layer mark V- contact parts ALWAYS_REFILL = False # refill zones even if KiCad says they are filled # --- Solver --- CONTACT_MODEL = "uniform" # "uniform": conductor pressed on top injects # orthogonally with uniform surface density # (J ramps across the contact); "equipotential": # ideal bonded lug (Dirichlet). The two bracket # a real contact: R_equi <= R_real <= R_uniform. SPSOLVE_MAX_UNKNOWNS = 500_000 # above this, AMG-preconditioned CG (pyamg; # Jacobi-CG if pyamg is missing). Direct is # exact and fastest for small grids; measured # at 1.4M unknowns: spsolve 13 s / ~3 GB, # AMG-CG 6 s at a fraction of the memory AMG_TOL = 1e-10 # relative residual of the AMG-CG solve CG_TOL = 1e-8 # Jacobi-CG fallback (no pyamg) CG_MAXITER = 50_000 # CG iterations are cheap; large grids need many # --- Geometry --- ARC_TOL_FRACTION = 0.5 # arc sagitta tolerance as a fraction of cell size # --- Plots / output --- CMAP_POTENTIAL = "viridis" CMAP_CURRENT = "inferno" CMAP_POWER = "magma" POWER_DYNAMIC_RANGE = 1e4 # LogNorm span for the power map (power ~ J^2) LOG_CURRENT_SCALE = True CURRENT_DYNAMIC_RANGE = 1e3 # LogNorm vmin = vmax / this DPI = 150 INTERACTIVE = True # False -> save PNGs only, never open windows OUTPUT_DIRNAME = "fill_res_results"