# PCB Board size: 86.18x71.89 mm (3.39x2.83 inches) - This is the size of the rectangle that contains the board - Thickness: 1.6 mm (63 mils) - Material: FR4 - Finish: None - Layers: 4 - Copper thickness: 35 µm Solder mask: TOP / BOTTOM - Color: Green Silk screen: TOP / BOTTOM - Color: White Stackup: | Name | Type | Color | Thickness [µm]| Material | Er | Loss tan | |----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------| | F.SilkS | Top Silk Screen | | | | | | | F.Paste | Top Solder Paste | | | | | | | F.Mask | Top Solder Mask | | 10 | | | | | F.Cu | copper | | 35 | | | | | dielectric 1 | prepreg | | 100 | FR4 | 4.5 | 0.020 | | In1.Cu | copper | | 35 | | | | | dielectric 2 | core | | 1240 | FR4 | 4.5 | 0.020 | | In2.Cu | copper | | 35 | | | | | dielectric 3 | prepreg | | 100 | FR4 | 4.5 | 0.020 | | B.Cu | copper | | 35 | | | | | B.Mask | Bottom Solder Mask | | 10 | | | | | B.Paste | Bottom Solder Paste | | | | | | | B.SilkS | Bottom Silk Screen | | | | | | # Important sizes Clearance: 0.2 mm (8 mils) Track width: 0.17 mm (7 mils) - By design rules: 0.0 mm (0 mils) Drill: 0.4 mm (16 mils) - Vias: 0.4 mm (16 mils) [Design: 0.4 mm (16 mils)] - Pads: 0.75 mm (30 mils) - The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH) Via: 0.6/0.3 mm (24/12 mils) - By design rules: 0.5/0.3 mm (20/12 mils) - Micro via: yes [0.2/0.1 mm (8/4 mils)] - Buried/blind via: yes - Total: 179 (thru: 179 buried/blind: 0 micro: 0) Outer Annular Ring: 0.1 mm (4 mils) - By design rules: 0.15 mm (6 mils) Eurocircuits class: 6C - Using min drill 0.35 mm for an OAR of 0.13 mm # General stats Components count: (SMD/THT) - Top: 70/2 (SMD + THT) - Bottom: 15/0 (SMD) Defined tracks: - 0.17 mm (7 mils) - 0.21 mm (8 mils) - 0.3 mm (12 mils) - 0.4 mm (16 mils) - 0.6 mm (24 mils) - 0.8 mm (31 mils) - 1.0 mm (39 mils) - 1.5 mm (59 mils) - 2.0 mm (79 mils) Used tracks: - 0.17 mm (7 mils) (35) defined: yes - 0.21 mm (8 mils) (38) defined: yes - 0.3 mm (12 mils) (267) defined: yes - 0.4 mm (16 mils) (16) defined: yes - 0.6 mm (24 mils) (42) defined: yes - 0.8 mm (31 mils) (22) defined: yes - 1.0 mm (39 mils) (77) defined: yes - 2.0 mm (79 mils) (10) defined: yes Defined vias: Used vias: - 0.6/0.3 mm (24/12 mils) (Count: 179, Aspect: 2.7 A) defined: no Holes (excluding vias): - 0.8 mm (31 mils) (12) - 1.3 mm (51 mils) (9) - 1.5 mm (59 mils) (10) - 2.4 mm (94 mils) (2) - 3.2 mm (126 mils) (3) Oval holes: - 0.65x1.15 mm (26x45 mils) (2) - 0.65x1.55 mm (26x61 mils) (2) Drill tools (including vias and computing adjusts and rounding): - 0.4 mm (16 mils) (179) - 0.75 mm (30 mils) (4) - 0.9 mm (35 mils) (12) - 1.4 mm (55 mils) (9) - 1.6 mm (63 mils) (10) - 2.4 mm (94 mils) (2) - 3.3 mm (130 mils) (3) Solder paste stats: Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³ and 1.0 g/cm³ for the flux. This paste has an specific gravity of 4.15 g/cm³. The stencil thickness is 0.12 mm. | Side | Pads with paste | Area [mm²] | Paste [g] | |--------|-----------------|------------|-----------| | Top | 243 | 294.21 | 1.46 | | Bottom | 34 | 38.84 | 0.19 | | Total | 277 | 333.05 | 1.66 | Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed. # Schematic ![Schematic SVG](Schematic/c64psu-schematic.svg){ width=16.5cm height=11.7cm } # PCB Layers ![PCB PDF](PCB/PDF/c64psu-pcb.pdf){ width=16.5cm height=11.7cm }